World’s largest contract chipmaker TSMC sees August revenue surge over 53% to record high

TechPublished Thu, Sep 10 20261:33 AM EDTUpdated 4 Min AgoKey PointsRevenue rose over 53% from a year earlier and more than 10% from July. The world’s largest contract chipmaker has continued to benefit from strong demand for chips used in artificial intelligence applications.The TSMC logo is displayed on a building in Hsinchu, Taiwan April 15, 2025. Ann Wang | ReutersTaiwan Semiconductor Manufacturing Co. reported record monthly revenue for August on Thursday, as demand for chips used in artificial intelligence applications remained strong.The world's largest contract chipmaker posted revenue of $514.8 billion New Taiwan dollars for August, up 53.3% from a year earlier and 10.1% from July.TSMC shares closed 0.61% lower on Thursday ahead of the revenue release. The company's monthly revenue has now risen for four straight months.During its second-quarter earnings call in July, TSMC said AI-related demand continued to be "extremely robust."The Taiwanese tech giant reported a more than 77% year-on-year jump in second-quarter profit and forecast third-quarter revenue between $44.6 billion and $45.8 billion.TSMC has maintained its dominance in the global foundry market, with a 72.5% market share in the second quarter, according to a data released by TrendForce Wednesday. Strong demand for AI server processors kept TSMC's advanced 5-, 4- and 3-nanometer capacity fully booked during the quarter, the research firm said.Samsung Foundry ranked second with a 5.9% share, followed by China's SMIC at 5.4%. The world's top 10 foundries posted record combined revenue of nearly $53.49 billion in the second quarter, driven in part by supply constraints for advanced processes used in AI and high-performance computing processors.Separately, TSMC and Dutch chip equipment giant ASML this week announced an initiative to advance the industry's transition to next-generation chipmaking technology.TSMC said it plans to use ASML's High NA technology in large-scale manufacturing for advanced nodes starting in 2030, with adoption expected to increase as AI applications require more complex transistor architectures.