Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP

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Postmedia has not reviewed the content. by Business Wire Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIPAuthor of the article:THIS CONTENT IS RESERVED FOR SUBSCRIBERS ONLYSubscribe now to read the latest news in your city and across Canada.Exclusive articles from Barbara Shecter, Joe O'Connor, Gabriel Friedman, and others.Daily content from Financial Times, the world's leading global business publication.Unlimited online access to read articles from Financial Post, National Post and 15 news sites across Canada with one account.National Post ePaper, an electronic replica of the print edition to view on any device, share and comment on.Daily puzzles, including the New York Times Crossword.SUBSCRIBE TO UNLOCK MORE ARTICLESSubscribe now to read the latest news in your city and across Canada.Exclusive articles from Barbara Shecter, Joe O'Connor, Gabriel Friedman and others.Daily content from Financial Times, the world's leading global business publication.Unlimited online access to read articles from Financial Post, National Post and 15 news sites across Canada with one account.National Post ePaper, an electronic replica of the print edition to view on any device, share and comment on.Daily puzzles, including the New York Times Crossword.REGISTER / SIGN IN TO UNLOCK MORE ARTICLESCreate an account or sign in to continue with your reading experience.Access articles from across Canada with one account.Share your thoughts and join the conversation in the comments.Enjoy additional articles per month.Get email updates from your favourite authors.THIS ARTICLE IS FREE TO READ REGISTER TO UNLOCK.Create an account or sign in to continue with your reading experience.Access articles from across Canada with one accountShare your thoughts and join the conversation in the commentsEnjoy additional articles per monthGet email updates from your favourite authorsSign In or Create an AccountPeakView®‘s automated xLEM™ flow extends Lorentz’s 3D EM leadership from design to full-chip EM sign-off, delivering complete, LVS-clean electromagnetic verification for today’s and next-generation ultra-high-speed AI, photonics and IC/3DIC designsSANTA CLARA, Calif. — Lorentz Solution, Inc., the world’s leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, today announced that it is jointly presenting with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum, to be held on Sept 23, 2026 in Santa Clara, CA. Their paper, “Large-scale Chip-level 3D EM Extraction and Sign-off of Ultra-high-speed Silicon Photonics and Custom Silicon IC/3DIC Designs with PeakView®,” marks the third consecutive year that Lorentz™ and NVIDIA will present cutting-edge EM technologies for real silicon designs at TSMC OIP.AI data centers are evolving into large-scale distributed compute fabrics, where millions of accelerators operate as a single system connected by ultra-high-bandwidth optical and co-packaged interconnects. At multi-terabit data rates, interconnects behave as distributed electromagnetic structures, and conventional RC-based parasitic verification fails to capture critical inductive effects, EM isolation, and lossy signal propagation. Chip-level EM sign-off verifying the true electromagnetic impact of every critical interconnect has become essential to first-silicon success.Get the latest headlines, breaking news and columns.By signing up you consent to receive the above newsletter from Postmedia Network Inc.A welcome email is on its way. If you don't see it, please check your junk folder.The next issue of Top Stories will soon be in your inbox.We encountered an issue signing you up. Please try againPeakView®‘s xLEM™ technology answers this challenge by extending traditional parasitic extraction into a fully automated, chip-level 3D fullwave EM extraction and back-annotation flow in the latest advanced IC and 3DIC nodes. Working directly from the LVS database, xLEM™ preserves connectivity across any design hierarchy, requires no schematic or layout rework, and automatically back-annotates up to thousands of ports with S-parameter and parasitic inductance models up to terahertz with no missing pieces and no double counting. The real custom-silicon sign-off cases presented in the paper demonstrate that automated, full-physics EM sign-off is now practical at chip level for the most advanced ultra-high-speed and silicon photonics designs.“For the third consecutive year, Lorentz is presenting with NVIDIA at the TSMC OIP Forum, advancing breakthrough EM design and signoff technologies for ultra-high-speed, energy-efficient data movement and computation for AI systems,” said Jinsong Zhao, President and Founder of Lorentz Solution, Inc. “For decades, Lorentz™ has pioneered advanced electromagnetic EDA software, supporting generations of semiconductor innovations. Today marks another milestone in our journey to advance innovation and deliver the advanced design capabilities required for the AI era. With xLEM™, PeakView® stands as the industry’s ultimate 3D EM design and sign-off platform.”About Lorentz Solution, Inc.Based in Silicon Valley, Lorentz Solution, Inc. is the world’s leading supplier of 3D electromagnetic (EM) simulation and design solutions for IC, 3DIC, and advanced packaging. Learn more at www.lorentzsolution.com.Lorentz™ and PeakView® are trademarks of Lorentz Solution, Inc. All other registered trademarks are the property of their respective holders.View source version on businesswire.com: This advertisement has not loaded yet.Notice for the Postmedia NetworkThis website uses cookies to personalize your content (including ads), and allows us to analyze our traffic. Read more about cookies here. By continuing to use our site, you agree to our Terms of Use and Privacy Policy.