HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem

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Postmedia has not reviewed the content. by Business Wire HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor EcosystemAuthor of the article:THIS CONTENT IS RESERVED FOR SUBSCRIBERS ONLYSubscribe now to read the latest news in your city and across Canada.Exclusive articles from Barbara Shecter, Joe O'Connor, Gabriel Friedman, and others.Daily content from Financial Times, the world's leading global business publication.Unlimited online access to read articles from Financial Post, National Post and 15 news sites across Canada with one account.National Post ePaper, an electronic replica of the print edition to view on any device, share and comment on.Daily puzzles, including the New York Times Crossword.SUBSCRIBE TO UNLOCK MORE ARTICLESSubscribe now to read the latest news in your city and across Canada.Exclusive articles from Barbara Shecter, Joe O'Connor, Gabriel Friedman and others.Daily content from Financial Times, the world's leading global business publication.Unlimited online access to read articles from Financial Post, National Post and 15 news sites across Canada with one account.National Post ePaper, an electronic replica of the print edition to view on any device, share and comment on.Daily puzzles, including the New York Times Crossword.REGISTER / SIGN IN TO UNLOCK MORE ARTICLESCreate an account or sign in to continue with your reading experience.Access articles from across Canada with one account.Share your thoughts and join the conversation in the comments.Enjoy additional articles per month.Get email updates from your favourite authors.THIS ARTICLE IS FREE TO READ REGISTER TO UNLOCK.Create an account or sign in to continue with your reading experience.Access articles from across Canada with one accountShare your thoughts and join the conversation in the commentsEnjoy additional articles per monthGet email updates from your favourite authorsSign In or Create an AccountCAMBRIDGE, Mass. — HyperLight Corporation (“HyperLight”), a leader in thin-film lithium niobate (TFLN) photonics, today announced that VentureTech Alliance (“VTA”) has joined its Series C financing round. VTA is a venture investment firm focused on the semiconductor industry, with a portfolio built across the semiconductor technology stack — including circuit design, foundry-adjacent process technology, EDA, advanced packaging, and photonics.VTA’s participation extends the ecosystem alignment that defined the round, which brought together investors spanning silicon ICs, foundry manufacturing, electronics manufacturing services, networking, and global infrastructure capital. With VTA’s addition, the syndicate now reaches further into the semiconductor manufacturing and design-enablement layers on which high-volume photonics production depends.“The transition to TFLN is not a component decision — it is an ecosystem decision,” said Mian Zhang, CEO of HyperLight. “Getting TFLN into volume requires the process, the design rules, the models, and the qualification data to be in place so that partners across the chain can build on a common foundation. VTA understands how semiconductor platforms get established, and their participation reflects where TFLN now sits in the roadmap: not as an emerging material, but as a layer the industry is designing around.”Get the latest headlines, breaking news and columns.By signing up you consent to receive the above newsletter from Postmedia Network Inc.A welcome email is on its way. If you don't see it, please check your junk folder.The next issue of Top Stories will soon be in your inbox.We encountered an issue signing you up. Please try againA platform designed to be built uponHyperLight’s TFLN Chiplet™ Platform unifies the requirements of short-reach IMDD data center pluggables, longer-reach coherent datacom and telecom modules, and co-packaged optics (CPO) within a single high-volume manufacturable architecture. Products supporting 200G-per-lane operation are in production, with 400G-per-lane solutions now sampling.Increasingly, the platform is consumed not only as a device but as an integration-ready building block: HyperLight’s TFLN engines are designed to be adopted as IP blocks within partners’ advanced packaging and co-packaged optics flows, alongside the design rules, device models, and reliability data required to bring them into a customer’s own design environment. The company’s underlying portfolio of more than 150 patents spans TFLN device architecture, high-speed electrode design, and manufacturing process, and forms the technology foundation of the platform.“TFLN’s bandwidth and power efficiency make it a necessary layer for next-generation AI interconnect; HyperLight’s TFLN platform makes it the natural foundation for the ecosystem to build on,” said Kai Tsang, Managing Partner, VentureTech Alliance.HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.View source version on businesswire.com: This advertisement has not loaded yet.Notice for the Postmedia NetworkThis website uses cookies to personalize your content (including ads), and allows us to analyze our traffic. Read more about cookies here. By continuing to use our site, you agree to our Terms of Use and Privacy Policy.