Download this complimentary White Paper today! Learn how guided virtual shock and drop analysis helps engineering teams identify reliability risks before physical testing, reduce qualification iterations, optimize packaging designs, and accelerate electronics product development. What you will learn about: Why shock failures found during physical qualification are costly, and how coupled electrical, mechanical, thermal, and packaging effects make them hard to predict. How physical drop testing and traditional simulation each leave gaps in timing, expertise, setup effort, and diagnostic detail. How guided, template-based virtual workflows model tilt drops, ball impacts, and packaged drops using IEC 60068-2-27 and IEC 60068-2-31 profiles. How running the full drop orientation matrix as one validation plan supports packaging optimization, and how correlation with physical tests builds confidence before hardware is committed. Click ‘LOOK INSIDE’ to Download Now. IEEE Spectrum and Wiley are proud to bring you this White Paper, sponsored by Keysight More Information Electronic products now pack circuits, structures, thermal paths, and packaging into very small spaces. These physical domains interact with one another. A packaging choice can change how a shock load reaches a circuit board. Such interactions are hard to predict. Most are found during physical qualification, late in development. At that stage, the design is mostly fixed. A failure leads to redesign, rebuilds, and retesting. Physical tests give strong evidence of robustness, but they give limited insight into load paths and failure margins. Traditional simulation gives more detail, but it needs specialist skills and long manual setup. This white paper explains how guided virtual validation brings shock and drop assessment into the design phase. It reviews common test configurations, model inputs, and acceptance criteria. A packaged drop case study then shows how packaging can be optimized across all drop orientations and checked against physical test results.
Catch Electronics Shock and Drop Failures Before Hardware Is Built
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